JPH079375Y2 - ウエ−ハ接着装置 - Google Patents
ウエ−ハ接着装置Info
- Publication number
- JPH079375Y2 JPH079375Y2 JP1990403615U JP40361590U JPH079375Y2 JP H079375 Y2 JPH079375 Y2 JP H079375Y2 JP 1990403615 U JP1990403615 U JP 1990403615U JP 40361590 U JP40361590 U JP 40361590U JP H079375 Y2 JPH079375 Y2 JP H079375Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pad
- pressing
- sticking plate
- pressurized fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003825 pressing Methods 0.000 claims description 38
- 239000012530 fluid Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 239000000428 dust Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000005498 polishing Methods 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990403615U JPH079375Y2 (ja) | 1990-12-18 | 1990-12-18 | ウエ−ハ接着装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990403615U JPH079375Y2 (ja) | 1990-12-18 | 1990-12-18 | ウエ−ハ接着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0488033U JPH0488033U (en]) | 1992-07-30 |
| JPH079375Y2 true JPH079375Y2 (ja) | 1995-03-06 |
Family
ID=31881367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990403615U Expired - Lifetime JPH079375Y2 (ja) | 1990-12-18 | 1990-12-18 | ウエ−ハ接着装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079375Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008254326A (ja) * | 2007-04-05 | 2008-10-23 | Sharp Corp | インクジェットヘッドの製造装置およびそれを用いるインクジェットヘッドの製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009131920A (ja) * | 2007-11-29 | 2009-06-18 | Ebara Corp | 研磨装置及び方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5932135A (ja) * | 1982-08-18 | 1984-02-21 | Toshiba Corp | 半導体ウエハの接着装置 |
-
1990
- 1990-12-18 JP JP1990403615U patent/JPH079375Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008254326A (ja) * | 2007-04-05 | 2008-10-23 | Sharp Corp | インクジェットヘッドの製造装置およびそれを用いるインクジェットヘッドの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0488033U (en]) | 1992-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |